Embedded Computer

MBX-IN3-DIN

DIN-Rail Rugged Box PC · Intel® Alder Lake-N Platform · 12-24 VDC · 2 × 2.5GbE

MBX-IN3-DIN product photo
CPU
Intel® Alder Lake-N N97 / X7425E / Core™ i3-N305
Memory
DDR5-4800 (non-ECC); up to 32 GB, 1 × DIMM
Graphics
Intel® UHD Graphics (integrated)
Ethernet
2 × 2.5GbE RJ45
Operating temp.
-10 to +60 °C
Overview Specifications Downloads Related Request a Quote →

Overview

  • Chipset — Intel® SoC Integrated
  • OS — Windows 11 Pro (64-bit) / Windows 11 IoT LTSC / Linux supported
  • BIOS — UEFI
  • Watchdog — 255 Levels

Specifications

Source: MBX-IN3-DIN
System
ProcessorIntel® Alder Lake-N N97 / X7425E / Core™ i3-N305
ChipsetIntel® SoC Integrated
MemoryDDR5-4800 (non-ECC); up to 32 GB, 1 × DIMM
GraphicsIntel® UHD Graphics (integrated)
OSWindows 11 Pro (64-bit) / Windows 11 IoT LTSC / Linux supported
BIOSUEFI
Watchdog255 Levels
SecurityTPM 2.0 IC onboard
GPIO8-bit GPIO (optional)
Storage
Main Storage1 × M.2 M-key SSD (NVMe)
SATA1 × 2.5" SATA SSD (optional)
SSD Slot1 × 2.5" removable storage bay
I/O Interface
LAN2 × 2.5GbE RJ45
Serial2 × COM: 1 × RS-232 (rear DB-9) + 1 × RS-232/422/485
USB1 × USB 3.2, 6 × USB 2.0, 1 × USB-C (DP Alt mode)
Display2 × HDMI
AudioHD Audio — line-in / line-out / mic-in
WirelessOptional Wi-Fi / BT (M.2 E-key / PCIe)
Power
Input12-24 V DC nominal (9-36 V DC for optional)
Consumption28 W
Power Adapter1 × AC/DC power adapter w/ power cord
Mechanical & Environment
Dimensions152.5 × 108 × 86.4 mm
CoolingFanless design with thermal fin
MountingDIN Rail mount / Bracket
Operating Temp.-10 to +60 °C
Storage Temp.-40 to +80 °C
File Type Access Get
MBX-IN3-DIN Datasheet PDF public Download
RGTS-MBX-IN3-DIN User Manual PDF Download

Mechanical drawings, manuals and compliance reports for this model are available on request — ask an engineer.

This model is a starting point

Panel size, brightness, connector set, rail depth, conformal coating and MIL-grade enclosures are all changeable. Send us the environment and we will quote the build.

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